標籤: other-photoresist

Laser ablation involves using laser irradiation to destroy and vaporize resist materials, creating t… read 閱讀全文

A new resist series sensitive to laser exposure in the 500-1100 nm range has been developed, enablin… read 閱讀全文

Polyimides, produced through a 2-step procedure, are suitable for high thermal strain due to their a… read 閱讀全文

This content discusses the use of two-layer polyimide systems for specific applications where the or… read 閱讀全文

The new special resist SX AR-N 4810/1 is a chemically amplified photoresist based on PMMA that offer… read 閱讀全文

The laser ablation of PPA (Phoenix 81) was studied, demonstrating its potential for precise structur… read 閱讀全文

The content discusses the use of photoresists to create fluorescent structures with adjustable emiss… read 閱讀全文

The dyed resists developed in the Photoenco project involved mixing dyes into the polymer matrix of … read 閱讀全文

The black resist developed can disable substrate transparency while allowing structure generation, c… read 閱讀全文