Product categroy

Residue clean

TSV clean 矽穿孔製程的殘留去除

Application for fluoro-polymer residue clean and mask remove (posi and nega photoresist) after the process of DRIE (deep reactive ion etching)

主要用途為非等向性深矽穿孔離子反應蝕刻製程中氟素樹脂的殘留與光阻去除,例如BOSCH DRIE製程的殘留去除。

Features

  • clean performance meet POR criteria
    殘留去除能力合乎製程需求
  • non-fluoro-based, non-hydroxylamine solution.
    非氟系,非羥基胺溶液。
  • PFAS free, TMAH free, NMP free.
    不含全氟和多氟烷基物質,,不含氫氧化四甲基銨,不含N-甲基吡咯烷酮。
  • product meet ESG and sustainable requirements.
    環境友善產品,合乎永續經營標準。

如需進一步資訊,歡迎聯系。

TSV clean

New seletive and versatile post etching cleaner 乾蝕刻殘留去除劑

Application for cleaning of resisue which produce from high k or MiM process

應用於各類乾蝕刻製程後的金屬氧化物殘留,例如高介電介質,MIM電容製程。

Features:

  • high metal salt solubility with organic acid.
    對金屬鹽殘留溶解能力強。
  • effective soluable on post dry etching polymer and seletive to Al and SiO2.
    選擇性的對電將蝕刻後的高分子殘留有溶解能力。
  • versatile application such as Al line clean, via clean, Cu damascene post etch clean, high k, and MIM post etch clean.
    用途廣範,適合於多站點半導體製程。

如需進一步資訊,歡迎聯系。


Developer TMAH 2.38% for versatile photosensitive materials

氫氧化四甲銨2.38%顯影劑

Features:

  • applicable to versatile photosensitive materials developing process.
    試合各類型感光材料顯影製程。
  • low metal ion content, low chloride content, low particle content.
    金屬離子,氯離子及粒子含量合乎製程標準。
  • packing with 20L and 200L drum. For immersion, batch and single wafer process.
    20L或200L桶裝,適合量產製程例如濕式浸泡,批次或單晶片設備。

如需進一步資訊,歡迎聯系。


Photoresist stripper – organic solvent mixture without NMP, DMSO and TMAH

通用型光阻去除劑 – 不含NMP,DMSO,TMAH成份

Features:

  • stripping machanism include lift off and dissolution.
    光阻去除反應含剝離與溶解。
  • high loading and bath life (>75 hours), low cost of owership.
    高承載片數與槽液壽命時間,使用成本低。
  • suitable for both positive and negative liquid photoresist.
    可使用於各類正,負型液態光阻。
  • compatiable with wide range materials, friendly to compoud wafer process.
    相容於各類型材料,適合敏感型基板如化合物半導體製程。
  • applicable on vresatile tools, such as wetbench, batch rotation, spray and single wafer.
    適合各類型機台,如濕式清洗,噴灑式,批次旋轉或單晶片式。
  • low freezing point incompare with DMSO type stripper, easier handle in storage.
    較低的結晶溫度(接近0℃)庫存容易。

如需進一步資訊,歡迎聯系。


Contents are base on principal’s product TDS
內容取材自原廠產品技術資料