Process instruction 製程參數說明

Pre-treatment prior to coating: 
The protective effect during etching can be extended to up to 8 hours if the surface is pretreated with adhesion promoter AR 300-80. The coating is preferably performed at 4000 rpm. After tempering at 180 °C for 2 min (hot plate), a uniform, 15 nm thin layer of adhesion promoter is formed (-> Product information AR 300-80)
塗佈前處理(增黏處理):
以AR 300-80增黏處理可使保護塗層於蝕刻時保護性增至8小時. 增黏塗層建議以4000轉塗佈再以180℃在熱盤軟烤2分鐘,可獲得15nm均勻的增黏塗層。 (細節請參考AR 300-80產品資訊)

Coating: 
A rotational speed of 1000 rpm is recommended for protective coatings, since at a film thickness of 2 – 5 μm wafer edges are best protected due to a certain “edge wrapping” of the resist. At higher spin speeds or if 6-inch wafers and above are used, the relatively high amount of resist which is deposited on the wafer may cause the so-called candy-floss effect. Low spin speeds, local exhaustion or removal of the “candy floss” with a glass rod during coating reduces these highly disturbing effects
保護塗層塗佈:
建議的轉速為1000轉.此轉數下，膜厚約2 – 5um，晶元邊緣亦可形成包覆。
在較高轉速的塗佈，或晶元大於6寸時，保護膠需滴定較大數量,此時容易形成”糖絲效應”。
降低轉速，排氣，或以玻璃棒移除絲狀物以減少其影響。

Tempering：
To obtain a particularly high protective effect for the fabrication of hard-baked films, tempering temperatures of 190 °C are recommended.
軟烤: 建議以 190℃ 高溫軟烤以獲得有效的保護塗層。

Etch process:
The protective coating is even after hours not attacked by 40 % KOH. Possibly occurring problems only derive from insufficient adhesive strength and can be significantly reduced with a pre-treatment with AR 300-80.
蝕刻製程：
保護塗層可耐40%氫氧化鉀幾小時的攻擊. 通常是由介面黏著度不夠而導致問題. 使用AR 300-80增黏劑可有效解決此問題.