SX AR-P 3500/8 product brief 產品說明
SX AR-P 3500/8產品為耐高溫正型光阻,耐溫可達300℃,適合各類高溫製程。
目前產品屬實驗型及可客製化調整,購買前需先詢問:

Packing & shipping 產品包裝與出貨

packing 產品包裝

✅ 250 ml/瓶

✅ 1 L/瓶

其它包裝可依需求研擬增加

shipping 產品出貨

本產品非固定排程生產,需先詢問交期與價格,可能的交期如下:

✅ 4 – 8 週。德國運出。

Product features 產品特性

  • broadband UV, i-line, g-line
    曝光波長: 寬頻紫外線, i-line (365nm) , g-line (436nm)
  • high plasma resistant, thermal stable up to 300 °C
    耐電漿,耐溫可達300℃
  • suitable for high-temperature 2-layer lift-off processes as well as plasma etching and implantation processes
    適合高溫製程,例如: 雙層懸浮剝離,電漿蝕刻, 離子植入等
  • combination of poly(hydroxystyrene-co-MMA) and naphthoquinone diazide
    主要成份為高分子共聚物(羥基苯乙烯-co-甲基丙烯酸甲酯)及叠氮基萘醌
  • safer solvent PGMEA
    使用較安全溶劑丙二醇甲醚醋酸酯

Product properties 產品物性

SX AR-P 3500/8 Spin curve 塗佈曲線

Structure and resolution 結構與解析度

Resist structure

7 um trenches with SX AR-P 3500/8

Resist structure (thermally stable)

10 μm webs of SX AR-P 3500/8 after a hard bake of 280 °C

Process parameters

SubstrateSi 4″ wafer
Soft bake95℃ x 2min, hot plate
Exposurei-line stepper (NA: 0.65)
DevelopmentAR 300-47, 1:1, 60 sec, 22℃

Process chemicals

Adhesion promoterAR 300-80
DeveloperAR 300-47
ThinnerAR 300-12
RemoverAR 300-76 / AR 300-70

Process baseline 製程參數

This diagram shows exemplary process steps for SX AR-P 3500/8 series resists. All specifications are guideline values which must be adapted to own specific conditions. For further information on processing, 👉“ Detailed instructions for optimum processing of photoresists”. For recommendations on wastewater treatment and general safety instructions, 👉”General product information on Allresist photoresists”.
表列為SX AR-P 3500/8系列產品製程參數的範例。所有參數為參考值,使用者應依設備環境實際狀況加以調整。

Development recipe

ResistDeveloper
AR 300-35AR 300-47
SX AR-P 3500/81 : 11 : 1

Contents are base on principal’s product TDS
內容取材自原廠產品技術資料