SX AR-P 3500/8 thermostable positive photoresist
For high temperature application up to 300℃
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SX AR-P 3500/8 product brief 產品說明
SX AR-P 3500/8產品為耐高溫正型光阻,耐溫可達300℃,適合各類高溫製程。
目前產品屬實驗型及可客製化調整,購買前需先詢問:

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Packing & shipping 產品包裝與出貨
packing 產品包裝
✅ 250 ml/瓶
✅ 1 L/瓶
其它包裝可依需求研擬增加
shipping 產品出貨
本產品非固定排程生產,需先詢問交期與價格,可能的交期如下:
✅ 4 – 8 週。德國運出。
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Product features 產品特性
- broadband UV, i-line, g-line
曝光波長: 寬頻紫外線, i-line (365nm) , g-line (436nm) - high plasma resistant, thermal stable up to 300 °C
耐電漿,耐溫可達300℃ - suitable for high-temperature 2-layer lift-off processes as well as plasma etching and implantation processes
適合高溫製程,例如: 雙層懸浮剝離,電漿蝕刻, 離子植入等 - combination of poly(hydroxystyrene-co-MMA) and naphthoquinone diazide
主要成份為高分子共聚物(羥基苯乙烯-co-甲基丙烯酸甲酯)及叠氮基萘醌 - safer solvent PGMEA
使用較安全溶劑丙二醇甲醚醋酸酯
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Product properties 產品物性


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SX AR-P 3500/8 Spin curve 塗佈曲線

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Structure and resolution 結構與解析度
Resist structure

7 um trenches with SX AR-P 3500/8
Resist structure (thermally stable)

10 μm webs of SX AR-P 3500/8 after a hard bake of 280 °C
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Process baseline 製程參數
This diagram shows exemplary process steps for SX AR-P 3500/8 series resists. All specifications are guideline values which must be adapted to own specific conditions. For further information on processing, 👉“ Detailed instructions for optimum processing of photoresists”. For recommendations on wastewater treatment and general safety instructions, 👉”General product information on Allresist photoresists”.
表列為SX AR-P 3500/8系列產品製程參數的範例。所有參數為參考值,使用者應依設備環境實際狀況加以調整。

Development recipe
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