Positive resist for temperature sensitive substrates

In many cases, substrates meant to be structured may not be heated above 50 – 70 °C. These can be glass partitions which distort at higher temperatures and thus might lose their size accuracy. However, some organic polymers which are to be coated are temperature sensitive. Moreover, thermosensitive structures may already exist on the substrates. For such substrates, SX AR-P 3110/6 is recommended, a positive photo resist which, due to its solvent mixture, dries considerably faster or, respectively, needs lower temperatures to dry completely. Since the adhesive strength of the resists usually depends on the tempering as well, an additional adhesive agent was added to this resist in order to make up for this deficiency.