Basics – EBL resist

Information on:

• Polymere resists (layer builder)
• Photosensitive components
• Cross linker
• Other resist components (adhesion promoter, tenside, solvent, colorant)
• Process information such as: Cleaning of substrates, adhesive strength, dilution of resists, yellow light, softbake, rehydration, exposure and storage
• Process procedures such as:   Lift-off procedures, wet-chemical etching, dry-chemical etching, UV-curing, lithographic procedures and stabilization/curing of resist layers

Reference to photoresist: General