How high is the adhesion strength of e-beam resists to different wafers?
Adhesion between substrate and coating is a sensitive feature of a resist, which is also true for e-beam resists.
PMMA-, copolymer and styrene acrylate resist are however significantly less prone for adhesion problems than e-beam resists of the AR 7000 product line, where smallest changes of the cleaning procedure or other parameters may have a fatal impact on the adhesion strength.
Silica, silicon nitride, and base metals (such as aluminium, copper) generally possess good resist adhesion features, while adhesion on SiO2, glass, noble metals such as gold or silver, and on gallium arsenide is often insufficient. In this case, measures have to be taken to improve adhesion ( Question 3: Pre-treatment of substrates).
If the air humidity is too high (> 60 %), adhesion is substantially reduced.
Overview of EBL resist FAQs
1. What are e-beam resists composed of, and how do they work?
2. For how long are e-beam resists stable, and what are the optimal storage conditions?
3. What is the optimal pre-treatment of substrates for e-beam resist application?
4. How high is the adhesion strength of e-beam resists to different wafers?
5. How are e-beam resists exposed? How can the optimum exposure dose be determined?
7. How can e-beam resist films be removed again?
8. Which resolutions do e-beam resists achieve?
9. How high is the plasma etch resistance of e-beam resists?
10. How high is the etch resistance of e-beam resists in the presence of strong acids?
11. How high is the solvent resistance of e-beam resist films?