Negative polyimide photoresist

As an alternative to the positive polyimide resist (SX AR-PC 5000/82.7) which is already a polyimide in dissolved form and thus requires no curing process (see „Positive polyimide resist“) at 350-400°C , also a negative resist was developed which works according to the principle of chemical enhancement. This resist is also stable at temperatures >400°C and is accordingly very well suited for the production of high temperature-stable structures. In this case, the developer is not aqueous-alkaline, but composed of MIBK. In particular for users who process moisture-sensitive substrates, the use of a polyimide negative resist is thus recommended.

The negative resist can also be structured by electron beam lithography. For users which are not able to work under yellow light conditions, the resist can also be offered as white-light variant.