How may age-related changes influence the quality of a photoresist?
During storage, red azo-dyes develop due to a thermal chemical reaction of the light-sensitive component with the novolac, causing a darkening of the resist. Even small amounts of the dye lead to darkening, which however has no significant effect on general resist properties.
Photoresists which were stored for several years are too old and may only be used with considerable limitations. This also applies to resists stored at high temperatures and to highly diluted resists which age faster than normal. Possible effects are the formation of particles due to a precipitation of the light-sensitive component. Filtration with a pore size of 0.2 µm may be helpful at an early stage. After repeated filtrations however, the steadily declining concentration of the light-sensitive component causes lower development rates, an increased dark field loss, as well as reduced adherence of the resist.
If resists are stored for prolonged times at higher temperatures against all recommendations (e.g. during the summer), nitrogen may be cleaved from the light-sensitive component which is indicated by fizzling and foaming after the bottle is opened. In this case, the lid of the bottle should be opened a bit and the bottle left undisturbed for 1 – 2 days until the resist has settled again. If the resist has not been kept for too long under improper storage conditions, it may still be used.
Overview of photoresist FAQs
1. What are photoresists composed of, and how do they work?
2. For how long are photoresists stable, and what are the optimal storage conditions?
3. How may age-related changes influence the quality of a photoresist?
4. What is the optimal pre-treatment of substrates for photoresists?
5. What are the adhesion features of photoresists on different wafers?
6. What are the optimum coating parameters for photoresists in order to achieve good film images?
7. Why may air bubbles develop in photoresist films, and how can they be avoided?
8. What is the function of the softbake of photoresist films after the coating?
11. How can resist coatings be removed again?
12. What is the application range of protective coatings?
13. How do image reversal resists work?
14. How can undercut patterns (lift-off structures) be produced in one- or two layer systems?
15. How can thick films of > 10 µm be processed in an optimal way?
16. Which resolution and which contrast can be obtained with photoresists?
17. How high is the plasma etch resistance of photoresists?
18. How high is the etch resistance of photoresist in the presence of strong acids?
19. Which photoresists are suitable for hydrofluoric acid (HF) etching?
20. How high is the solvent resistance of photoresist films?