How do image reversal resists work?
With image-reversal resists such as AR-U 4000, positive or negative tone images can be generated of the optical transmitted pattern depending on the manufacturing process. If the resist is processed according to the general protocol for positive resists without any additional steps, it works like a normal positive tone resist.
With the additional process steps “reversal bake” after image-wise exposure and subsequent “flood exposure”, the material provides a negative resist image which is characterised by a particularly high contrast of patterns. As guideline value for the reversal bake, 30 min at 100 °C in a convection oven or 5 min on a hot plate at 115 °C is recommended. The subsequent flood exposure (2- to 3-fold exposure dose of the initial exposure) converts the unexposed areas into a developable form. For optimal patterning, the process steps image-wise exposure, flood exposure, and development have to be coordinated thoroughly.
Overview of photoresist FAQs
1. What are photoresists composed of, and how do they work?
2. For how long are photoresists stable, and what are the optimal storage conditions?
3. How may age-related changes influence the quality of a photoresist?
4. What is the optimal pre-treatment of substrates for photoresists?
5. What are the adhesion features of photoresists on different wafers?
6. What are the optimum coating parameters for photoresists in order to achieve good film images?
7. Why may air bubbles develop in photoresist films, and how can they be avoided?
8. What is the function of the softbake of photoresist films after the coating?
11. How can resist coatings be removed again?
12. What is the application range of protective coatings?
13. How do image reversal resists work?
14. How can undercut patterns (lift-off structures) be produced in one- or two layer systems?
15. How can thick films of > 10 µm be processed in an optimal way?
16. Which resolution and which contrast can be obtained with photoresists?
17. How high is the plasma etch resistance of photoresists?
18. How high is the etch resistance of photoresist in the presence of strong acids?
19. Which photoresists are suitable for hydrofluoric acid (HF) etching?
20. How high is the solvent resistance of photoresist films?