Chemically enhanced negative resist without cross-linking
In some applications, the substrate on which the negative resist is to be applied cannot be heated. This may be the case for sensitive glass and especially for very big substrates. For instance, the negative resist is used for the structuring of a 4 meter copper cylinder for carpet printing. The patterns are etched into the copper with a trivalent iron chloride solution. A tempering of the cylinder up to 95 °C is not possible though. AR-N 4400-10, however, still crosslinks sufficiently after exposure at room temperature over night. The developer should merely be diluted to some extent. At higher temperatures, e.g. a water bath of 40 °C, the crosslinking temperature can be reduced to a few hours only.
Overview of negative photoresist
Alkali-stable and solvent-stable negative resist
Chemically enhanced negative resist (Process parameters and resolution)
Chemically enhanced negative resist without cross-linking
Coloured negative photoresists
Development of thick negative resist layer
Dose-dependent structure size with negative resists
Fabrication of vertical flanks with CAR 44
Generation of undercut structures with negative resists
Negative polyimide photoresist
Negative two- layer lift-off system
NIR-laser structurable photoresists
poly(hydroxystyrene) and (hydroxystyrene-co-MMA) photoresist with high-temperature stability
Sensitive negative PMMA resist (CAR)
Sensitive negative resist for 405 nm laser direct exposure